New Event Explains Polymer Production Efficiency

Four UK polymer companies will hold a new one-day conference entitled 'Improvement in Production Efficiency', which is aimed at increasing performance and efficiency in the processing of plastics. GandA Moulding Technology, a plastics consultancy and training provider, will host the event at its Peterborough facility on 13 April 2010 and will repeat it the following day. This is in conjunction with machinery supplier Premier Moulding Machinery (PMM), polymer distributor Velox (UK) and Triton Technology.

The conference will consist of a series of papers and practical demonstrations intended to be of interest to polymer processors that are seeking to boost their own production efficiency. At the event, GandA will present its Pro-Op process-optimisation software, which allows users to optimise their processing in a step-wise and logical approach, with an emphasis on process consistency and component quality and, as a consequence, a fall in energy costs through the reduction of scrap and downtime.

PMM will present the Venus series of all-electric injection-moulding machines from Zhafir Plastics Machinery. The Venus series can result in 20 to 70 per cent less energy consumption compared with hydraulic machines and a 10 per cent lower consumption than other general servo machines. PMM will hold a live demonstration of the Asaclean purging compound and mould cleaner for extrusion and injection-moulding equipment. Triton Technology will show its Identipol QA, which uses Dynamic Mechanical Analysis (DMA) and Differential Scanning Calorimetry (DSC) to provide simple and cost-effective quality-assurance testing of mouldable thermoplastics.

It can help prevent the loss of time and money on sub-standard materials. Beyond practical demonstrations of the equipment and systems mentioned above, there will be talks on the advantages of injection-moulding technology training and the savings to be made by investing in power-efficient equipment.

ISD860 Drives Gives High Servo Performance Control

Based on Technosoft Motionchip DSP technology, ISD860 is a flexible intelligent drive. It has been developed for motion applications that require cost-optimised design, embedded intelligence, networking possibilities and high servo performance control. It is able to drive 12A continuous and 31A peak currents at a supply voltage ranging from 12 to 72V DC, with a PWM of 20 kHz frequency. Embedding motion controller, drive and PLC functionality in one 136 x 84 x 26mm unit, ISD860 controls brushless, DC or linear motors up to 860W continuous/2.2kW peak voltage.

Due to its advanced motion-control algorithms, a precise control of position, speed or torque over a range of dynamic conditions can be achieved. ISD860 works in single-axis, multi-axis or standalone configurations. The drive setup, tuning and motion programming are made simple with Easymotion Studio and Technosoft Motion Language (TML), according to the company. With ISD860, motion programming can be done from a CAN master, via PC/PLC, using the appropriate motion library, or directly at drive level through its built-in motion controller.

The embedded Technosoft Motion Language includes a high-level command protocol, which can be used by the host through the onboard RS232/CAN serial interfaces. A CANopen version of the ISD860 drive, supporting DS-301 and DSP-402 profiles, is also available. In standalone operation, ISD860 can be managed with programmable I/Os or analogue inputs. Using the TML language, multiple operations can be performed with ISD860: setting of various motion modes (profiles, PVT, PT, electronic gearing or camming, etc), change of motion modes and/or parameters, execution of homing sequences or program flow control.

At the same time, IDS860 can handle digital I/O and analogue input signals, execute arithmetic and logic operations, and transfer data between axes. The drive is able to control other axes via motion commands. ISD860 can send commands to a group of axes, or synchronise all the axes from a network. Flexibility and easy implementation make ISD860 suitable for higher-power motion axis-control using modern distributed intelligence architecture. The drive is suitable for cost-sensitive applications, from medical to factory automation, requiring high servo performance and enhanced compactness.

Esab Introduces Origo Tech 9-13 Welding Helmets

Esab's Origo Tech 9-13 range of welding helmets, masks and screens offer superior face, head, ear and neck protection. They are available in striking high-gloss colours and feature the Esab comfort headgear with a lightweight shell. Since they offer higher levels of security for the wearer, it is possible to use the Origo Tech 9-13 to weld in all positions. The Esab variable-shade ADF is screwed into a slightly curved cradle designed to seal out dangerous levels of light.

The front spatter lens is also curved for extra strength and security. The external shade-adjustment varies between DIN 9 and 13, which can be adjusted from inside the helmet. The helmet is suitable for MIG/MAF, MMA and TIG (more than 20A) welding. The 0700 000 296 model is primarily black and the 0700 000 298 helmet is mostly yellow. The Origo Tech 9-13 comes in an Esab display box, fully assembled and ready to use.

Also available from Esab is a comfortable, lightweight and durable battery-powered respiratory unit designed to snugly fit the Origo Tech welding helmets. This offers the welder clean, filtered air in some of the most challenging welding conditions, resulting in increased comfort and safety for the welder. The Origo Air comes with an eight-hour battery, P3 filter, comfort pad, waist belt and an air hose with a fitted Proban hose cover.

Every Origo Air comes with an intelligent charger to ensure prolonged battery life and reduce the risk of over-charging. The battery-powered air filter is also equipped with a low-flow alarm that makes a noise when it is blocked or the battery is running low.

JVL Servo Motors Support Modbus RTU Protocol

The latest firmware for JVL Industri Elekronik's integrated servo motors - MAC400 and MAC800 - now supports the Modbus RTU protocol. The implementation supports the Read Holding Registers and Write Multiple Registers commands, which will give R/W access to all motor registers at speeds up to 1Mb/sec, though typically the PC standard rates of 9,600;115,200 and 230,400 bit/sec would be used.

The implementation uses the original V1.1 version of the Modbus protocol for maximum compatibility. For systems requiring a two-wire RS-485, the MAC00-P4 interface module is used. For four-wire RS-422, the MAC00-FSx modules or one of the MAC00-Bx modules are used.

Sysgo Software Offers Multi-Core Implementation

Sysgo has released version 3.1 of its flagship product, PikeOS, which is said to offer the first multi-core implementation on the market that is part of a DO-178B-certified code basis. The release maintains what is said to be one of the main benefits of PikeOS technology: the same core components are used whatever the market segment. Application specifics are isolated within 'personalities', a concept that allows all PikeOS customers to benefit from the same software layers underneath: PikeOS System Software and PikeOS micro-kernel.

Multi-core support through a flexible approach is made available to the user, who can select an execution model ranging from a pure AMP (Asymmetric Multi Processing) to full SMP (Symmetric Multi Processing). The SSV (safe and secure virtualisation) design developed by Sysgo makes it particularly suitable for multi-core architectures. The resource and time partitioning model makes the development of concurrent applications on multi-core platforms easier for the user: only core assignment needs new action from the user and the rest of the partitioning remains the same as before.

Multi-core related code is integrated within the certified code basis and is hardware agnostic, in line with the original PikeOS principle. Supported processors are the x86, PowerPC, MIPS, ARM and SPARC. The supported personalities are the PikeOS Native, ARINC-653, Linux, Posix and Certified POSIX. The multi-core capability is fully implemented on Intel families. Available hosts are Windows and Linux.

Schmartboard Boards Target SMT Connectors

Schmartboard has announced a range of boards for prototyping with Surface Mount Technology (SMT) connectors. These boards support SMT connectors from companies such as Hirose, Molex, Samtec and Tyco, and pitches of 0.4, 0.5, 0.8, 1 and 1.27mm. They also use Schmartboard Ez technology, the company's solution for hand soldering surface-mount components.

Schmartboard Ez allows the user to keep components in place on solder pads and to solder small areas without creating short circuits on the chip legs.

Holotouch Launches Touchless Interface

HoloTSFS408 is a touchless human-machine interface that is operated by inserting a finger into the holographic image of OPEN floating freely in its central cavity. It is powered by a switch-mode, regulated 5V DC output power supply with input voltage that can range from 100V AC to 250V AC at 50, 60 or 400Hz, and has a maximum output current of 1A DC. In demonstration units, there is an auxiliary, unregulated output of 10V DC that is used to power the green LED array at the bottom of the demonstration stand.

Internal components of HoloTSFS408 consist of a hologram, an LED to reproduce its holographic image and an infrared sensor, the 'sweet spot' of which coincides with the centre of the plane of its reproduced holographic image. The hologram is laminated between two 2.5 x 2.5in plates of 1/8in acrylic. HoloTSF408's reproducing light source is a super-white LED with a luminous intensity of 20,000mCd (If=20mA), a viewing angle of 20 and a forward voltage of 3.2V. HoloTSF408's sensor is a distance-measuring sensor unit composed of an integrated combination of photo diode, infrared emitting diode and signal-processing circuit.

An object must remain in the infrared sensor's sweet spot (50mm from sensor) for at least 160msec in order to generate an activation command. There is an 800msec inter-activation interval programmed into HoloTSF408's infrared sensor. This sensor consumes 5mA. HoloTSF408 is a double-insulated product and, as such, does not require a ground-wire connection.