Nihon Presentation Assesses Lead-Free Soldering

Nihon Superior, a supplier of advanced soldering and brazing materials, has announced that a new presentation about the challenges and issues in lead-free soldering is now available on its website. Copper erosion, voiding and tin whiskers are only a few of the problems in the field of lead-free soldering. Nihon Superior claims that it has has experience with and good knowledge of SN100C, which can reduce bridges with uniform eutectic solidification, provide good through-hole fill and reduce voiding, resulting in low defect manufacturing and high reliability.

Additional performance features of SN100C include excellent melting performance, the prevention of shrinkage cavities, good ductility, reduced copper erosion and stabilised IMC. It provides a long service life in thermal cycling conditions, a good impact resistance in BGA applications and vibration resistance.

New Board Simplifies Soldering Of Propeller Chip

Schmartboard has released a development board for the Parallax Propeller chip. The Propeller chip makes it easy to rapidly develop embedded applications. Its eight processors (cogs) can operate simultaneously, either independently or co-operatively, sharing common resources through a central hub.

The developer has full control over how and when each cog is employed. There is no compiler-driven or operating-system driven splitting of tasks among multiple cogs.

A shared system-clock keeps each cog on the same time reference, allowing for true deterministic timing and synchronisation. The new Propeller board will give the user the ability to hand-solder the components onto the board. Schmartboard's 'EZ' technology simplifies the soldering of the Propeller, allowing anyone to do it.