Nihon Superior, a supplier of advanced soldering and brazing materials, has announced that a new presentation about the challenges and issues in lead-free soldering is now available on its website. Copper erosion, voiding and tin whiskers are only a few of the problems in the field of lead-free soldering. Nihon Superior claims that it has has experience with and good knowledge of SN100C, which can reduce bridges with uniform eutectic solidification, provide good through-hole fill and reduce voiding, resulting in low defect manufacturing and high reliability.Additional performance features of SN100C include excellent melting performance, the prevention of shrinkage cavities, good ductility, reduced copper erosion and stabilised IMC. It provides a long service life in thermal cycling conditions, a good impact resistance in BGA applications and vibration resistance.
