The connector also allows engineers to design more reliably for dust-laden or damp environments, as the cards can be sealed inside the final product. The MES3055 is fully qualified to relevant MIL and EIA standards and will withstand a 50G shock without loss of electrical connectivity. Available in tape-and-reel packaging for volume manufacturing, the MES3055 offers coplanarity of +/-0.05mm while withstanding IR reflow at temperatures up to 260C.
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Hinged Connector Suits High-Vibration Environments
The connector also allows engineers to design more reliably for dust-laden or damp environments, as the cards can be sealed inside the final product. The MES3055 is fully qualified to relevant MIL and EIA standards and will withstand a 50G shock without loss of electrical connectivity. Available in tape-and-reel packaging for volume manufacturing, the MES3055 offers coplanarity of +/-0.05mm while withstanding IR reflow at temperatures up to 260C.